TACTICAL COMBAT CASUALTY CARE: GUIDELINES FOR MEDICAL PERSONNEL (TCCC-MP, 2021)



Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

New surface mounting and packaging technologies, using self-assembly with chips having cavity structures, were investigated for three-dimensional (3D) and hetero integration of complementary metal-oxide semiconductors (CMOS) and microelectromechanical systems (MEMS).By the surface tension of small droplets of 0.5 wt% hydrogen fluoride (HF) aqueous

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Spatial Resolution Requirements for the Application of Temperature and Emissivity Separation (TES) Algorithm Over Urban Areas

Current thermal infrared satellite images are full of mixed pixels.This work is a quantitative analysis, based on radiative transfer modelling, of the distribution of mixed pixels and their impact on the use of temperature and emissivity separation (TES).TES was applied to radiance images of the cities of Basel and Heraklion simulated at different

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